Running the AI Marathon: Key Takeaways from the Future of Memory and Storage Conference (FMS2025)
Running the AI Marathon: Key Takeaways from the Future of Memory and Storage Conference (FMS2025)
By Jean S. Bozman, Cloud Architects LLC
Running the AI Marathon
Scaling AI is like running a marathon.
Before the main event, you must prepare, acquiring the memory and storage to scale up for today – and planning your pathway to support even more infrastructure this year, next year – and all the way through to 2030.
The Future of Memory and Storage (FMS2025) conference, held in Santa Clara, California (Aug. 5 – Aug. 7) made this clear: the ability to scale up AI workloads is now a “cornerstone” for your data-center infrastructure projects.
The good news is this: You won’t have to run all your AI-enabled workloads alone, because there are cloud resources that can be tapped as you scale-up fast-growing AI workloads, and you won’t have to hire an army of employees who have scale-up AI skillsets.
Rather, you can scale beyond your own data-center’s infrastructure resources by tapping cloud services from providers who have vast resources already – including CSPs and hyper-scalers such as Amazon Web Services (AWS), Microsoft Azure, Google Cloud, IBM Cloud , Oracle Cloud (OCI) and others.
AI-Enabled Workloads are Everywhere—and Growing
“Artificial intelligence is no longer just part of the conversation—it is the conversation,” said Tom Coughlin, Conference Chair of FMS2025 and past president of the IEEE in 2024. “From hardware optimization to real-time data processing, AI is influencing every aspect of the memory and storage ecosystem,” Coughlin said. “FMS 2025 brings the brightest minds together to explore what’s next.”
As companies adopt AI capabilities to optimize business applications, they are learning more ways to take advantage of the memory that they have already bought. However, they will likely acquire more memory and storage for their systems in 2025 – and they will likely buy more capacity in 2026.
Better utilization of memory and storage will increase the value of the CPUs and GPUs that are already installed in the customer’s data centers, said Siamek Tavallei of Samsung.
Tavallei, who spoke at FMS2025, is past president of the CXL Consortium and member of the steering committee of the OCP (Open Compute Project). “They now need more memory and they need more space to make [their infrastructure] even more valuable, he said at the FMS2025 Closing session.
Industry Context
Customers’ rapid adoption of AI and GenAI technologies for business analysis is taking “center-stage” for enterprise businesses – impacting IT decisions across-the-board. By way of context, a recent IDC study reported that global enterprises will invest at least $307 billion on AI solutions in 2025 – a number that IDC expects to double by 2028 – reaching $632 billion worldwide.
Staying ahead of trends is critical, because businesses are facing the rapid evolution of AI and GenAI. According to a recent IDC study, global enterprises will invest a staggering $307 billion on AI solutions in 2025, a number expected to soar to $632 billion by 2028.
According to the IDC report, key impacts across businesses, both in the U.S. and worldwide, include the following: strategic planning, which is influencing customers’ AI and GenAI investments; resource allocation, by which customers must understand how to allocate financial and IT resources to support future AI requirements.
The IDC report listed risk and opportunity management, by which customers will understand the key factors driving AI adoption in their organization, impacting both current and future investments. These factors appear to be central to AI adoption, because they emerged in customer and vendor presentations, and they were cited again, and again, over the three days of the FMS2025 conference.
For the memory sector, Yole Group estimates that the worldwide memory market will grow from $170 Billion in 2025 to $302 Billion in 2030 – and that HBM will grow from 10% of worldwide memory revenue in 2025 to 33% of memory revenue in 2030.
Keynoters’ Key Takeaways at FMS2025
Keynote speakers spoke about adapting architectures to handle ever-larger AI models and inference tasks across Cloud, Edge, and Embedded systems.
“AI is shaping the future — and memory and storage are the foundation,” Tom Coughlin said. “FMS is the place where the entire ecosystem meets to solve these challenges head-on.”
FMS2025 keynotes were delivered by executives from FADU, KIOXIA, KOVE, Micron, Samsung, Sandisk, Silicon Motion, SK Hynix, Neo Semiconductor, and Verge/IO.
It’s worth noting that AI – an oft-mentioned topic – was not the only topic of the conference keynotes and breakout sessions. Other key themes of the conference included: system optimization, network connectivity, and the evolution of new materials for memory and storage devices. Techniques for scaling up memory and storage, managing data-center systems and power/cooling for dense data-center infrastructure were major discussion topics throughout the three-day conference.
Emerging standards for new technologies were highlighted, including 3D Memory, CXL (Compute Express Link) and UCI/e (Universal Chiplet Interconnect/Express, and other technical topics that are undergoing repeated reviews by international standards consortia around the world.
Looking ahead, wider use of optical interconnects, such as those from Broadcom and Cisco, are on the planning horizon for many customers – to support faster data-transfers between GPU-dense AI systems and an IT landscape with expanding storage capacity. We expect that optical interconnects, and the use of specific-purpose chiplets, will grow over the next five years, as customers build out their infrastructure to meet the demands of a wider constellation of enterprise workloads.
The Drive to Support New Materials
It’s worth noting that many of these emerging and rapidly-growing scalable AI workloads would not have been possible without a new array of materials and interconnects that have emerged since 2017.
Recent years have shown the importance of the emergence and advancements in 3D-DRAM and new types of storage media – as highlighted in the FMS2025 keynotes at the conference. Amazingly, storage devices supporting HDDs and SSDs as media are both showing strong acceptance in the marketplace.
Indeed, the arrival of new materials is enabling the design and fabrication of new CPUs, GPUs, memory (DRAM), NAND, SSDs, storage media, and a new generation of fast interconnects to tie a wide array of memory and storage devices together.
More are on the way – including fast optical interconnects and building blocks for extensible data fabrics that span the data center.
Although analysts and vendors had expected HDDs to decline, starting a decade ago, that has not been the case – as customers find the economics and usefulness of HDDs for long-term and archived data to be valuable as part of a large set of storage options in the enterprise.
Key Tech Takeaways from the Conference
- HBM – and Why It’s Needed: High-bandwidth Memory (High Bandwidth Memory) is an important ingredient for scaling AI systems and storage inside the data-center and across hybrid cloud networks. Now that AI systems require high-density memory and faster processing, HBM growth is increasingly driven by scale-up AI systems and storage. HBM is computer memory, based on 3D stacked memory and advanced DRAM packaging, for purposes of improving density and efficiency. Designed for high-performance computing (HPC) and graphics processing, HBM supports denser memory configurations and shorter data paths. This results in higher bandwidth and lower power consumption than traditional memory infrastructure.
- HBM Memory Growth Reflects Customers’ Demand for Memory Capacity: For the memory sector, Yole Group estimates that the worldwide memory market will grow from $170 Billion in 2025 to $302 Billion in 2030 – and that HBM will grow from 10% of worldwide memory revenue in 2025 to 33% of memory revenue in 2030.
- Optimizing Memory for Demanding Workloads. There is a wide range of workload requirements for memory capacity, for storage capacity, for CPU and GPU support, for networking and interconnects. This means that customers must have the technical expertise in-house, or they must pay for additional personnel and services to optimize their infrastructure resources. AI is commanding much of the attention right now, but optimization for many categories of applications is needed, both to avoid I/O bottlenecks and to build overall system capabilities.
- Storage Capacity. Memory and storage are both growing – demonstrating the need for strategic planning. AI, HPC and other demanding workloads are all on growth paths to meet workload demands by 2030. Customers should not plan for each workload segment in isolation, but rather, they should view memory and storage as elements of a much broader solution to meet capacity requirements and workload-focused system optimization throughout their infrastructure. A “build-or-buy” decision is baked into these planning decisions: whether to buy memory and storage capacity now, or to acquire capacity by working with suppliers and partners, over planning horizons of 1 to 5 years.
- Faster Interconnects: Faster building-blocks for memory and storage make it possible to shuttle data back and forth more quickly. But the sheer amount of data used for AI/ML workloads is so large that this shuttling of data leads to I/O bottlenecks that slow the entire end-to-end process down considerably. Removing the I/O bottlenecks is a pragmatic solution, wherever and whenever possible – although customers must also consider which places within their infrastructure need the most optimized data-transfer efficiencies.
- Improved Power/Cooling: The rush to support AI/ML workloads is driving a higher order of power/cooling capabilities for customers’ data centers. Many techniques are being applied to keep power/cooling costs from mushrooming too quickly. These include air-cooling, liquid cooling with water, and liquid cooling with crystal-clear chemical solvents for immersive solvent-bath cooling, or for cooling through flexible tubes that carry the solvents away from the systems and storage that generate heat “inside the box.”
- IT Skillsets – and Vying for IT’s Attention and Resources: As we said at the beginning of this research note, working with AI workloads and the need to scale-up more efficiently in the data-center is taking up much of the technical attention for customers. But again, working with scale-up AI is really a marathon – and not a sprint. Customers must do careful analysis of which places in their infrastructure – or in the hybrid cloud – need the most attention – and then work to morph their IT capabilities accordingly.
Inside Your Data Center
Those technical approaches – and more – were described in dozens of sessions throughout the FMS2025 conference, which focused on Memory and Storage and their evolving uses.
It’s worth noting that many of these scalable AI workloads would not have been possible without a new array of materials and interconnects that have emerged since 2017. Recent years have shown the emergence and advancements in 3D-DRAM and new storage media – highlighted in the FMS2025 keynotes at the conference.
Indeed, the arrival of new materials is enabling the design and fabrication of new CPUs, GPUs, memory (DRAM), NAND, SSDs, storage media, and a new generation of fast interconnects to tie a wide array of memory and storage devices together.
More are on the way – including fast optical interconnects and new types of data fabrics that span the data center.
One More Way to Cope with Scale-up AI — Tapping the Clouds
Optimizing the infrastructure for next-generation data-centers will take many paths – including key decisions about what computing and storage will be “sent” to outside resources, including public and private clouds.
At FMS2025, many speakers said companies – even large ones – should not plan to deploy all of their IT infrastructure themselves. Rather, they should plan to “tap” public clouds, private clouds and sovereign clouds to add capabilities and bandwidth to the overall capacity they will be using in the 2020s and 2030s. Some companies said they already have two or three cloud providers (CSPs) or hyper-scalers that are working as partners to support their fast-growing AI workloads.
Imagining the Future
Seeing ahead to what’s next is key to corporate success in advancing memory and storage. But seeing it is not enough – acting on your strategy is equally important. As part of our ongoing industry and technology analysis, we note two stellar examples of looking ahead:
- IBM CEO and chairman Arvind Krishna, when he became CEO in April 2020 – declared a dual strategy to adopt and support hybrid clouds (HCI) and AI/ML. He saw the wave coming – and he declared those goals clearly. From a 2025 perspective, it certainly looks like he correctly focused on these mega-trends.
- The late Gene Amdahl, who left IBM to become founder of Amdahl Corp., anticipated the need for multiple waves of materials-science advancements to reach high-performance computing goals (HPC). Back in the 1990s, he said that bringing memory, storage and compute closer together – at higher speeds – would revolutionize computing, enabling new kinds of workloads that would not have been possible in the 1990s – some 30 years ago. Now, clearly, optimization through deeper integration of infrastructure is widely accepted and adopted.
- This FMS conference featured an executive AI panel session, called Memory and Storage Scaling for AI Inferencing, including speakers from NVIDIA, KIOXIA, IBM, VAST Data, and SK Hynix discussing how they are pushing the limits of compute and memory bandwidth to meet the demands of today’s fast-growing AI workloads – and tomorrow’s demanding AI workloads, handling much more data for both model-training and inference purposes.
Adding to Your Company’s (People) Skill-sets
As mentioned, above, technology alone is not enough to achieve your memory and storage goals. Tech advances grab our attention when new products are announced. But clearly, using these memory and storage capabilities must be accompanied by new “people-based” skill-sets – for employees and managers in IT and in business.
Running a marathon is all about preparation and staying in the field over the long-run. It isn’t accomplished on the day of the event – but the event’s outcome is often determined by the planning, the strategy and the exercise that lead to any “event-day” performance.
Companies that plan to improve their business results by leveraging new technologies will see better results by taking stock of their infrastructure’s current capabilities – and by working with business partners to expand their memory and storage capacities to meet the demands of AI-enabled era.